International Journal of Advanced Computing and Communication Systems

Experimental analysis of Thermal conductivity of enamel filled with micro and nano composite of SiO2and TiO2

Selva Kumar B, Velmuruganand P and Sakthivel P, M.E PED, Dept of EEE, Coimbatore, Tamil Nadu, India.

International Journal of Advanced Computing and Communication Systems

ISSN (Online) : 2347 - 9299

ISSN (Print) : 2347 - 9280

Received On :

Revised On :

Accepted On :

Published On :

Volume 02, Issue 02

Page No : 021-024

Abstract

Thermal conductivity plays an important role on the thermal withstand capability of the insulating materials. It has been observed that the use of nano composites in the matrix of polymeric materials can greatly improve the thermal, mechanical and electrical properties of polymeric nano composites. A nano composite (TiO2 +SiO2) has been tested as nano filler. The micro particles of TiO2 and SiO2 are converted into nano particles with the help of ball mill. Scanning electron microscope (SEM) has been used to augment the particle size of nano composite. These nano composites were mixed with standard (Elmo Luft 1A-FD) enamel with help of ultrasonic vibrator. The thermal conductivity of enamel, micro composite (3:1, 1:3, 1:1 of SiO2 and TiO2) filled enamel and nano composite (3:1, 1:3, 1:1 of SiO2 and TiO2) filled enamel were detailed and analysed. Thermal conductivity was measured by using Lee’s Disc method. The mixing of nano composites of SiO2 and TiO2 with enamel in various proportions has no improvement when and the enamel filled with micro composites of SiO2 and TiO2 but reduced thermal conductivity when compared to the thermal conductivity of the enamel compared to that of SiO2 and TiO2. The enamel and micro composite of SiO2 and TiO2 proportion of 3:1 filled enamel has thermal conductivity.

Keywords

Thermal Conductivity, Ball Mill, SiO₂, TiO₂, Scanning electron microscopy.

Cite this Article

Selva Kumar B, Velmuruganand P and Sakthivel P, “Experimental analysis of Thermal conductivity of enamel filled with micro and nano composite of SiO2and TiO2,” International Journal of Advanced Computing and Communication Systems, pp. 021-024, July, 2015.

Copyright

© 2015 Selva Kumar B, Velmuruganand P and Sakthivel P. This is an open access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.